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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - First integration of Cu TSV using die-to-wafer direct bonding and planarization

✍ Scribed by Leduc, Patrick; Assous, Myriam; Di Cioccio, Lea; Zussy, Marc; Signamarcheix, Thomas; Roman, Ant; Rousseau, Maxime; Verrun, Sophie; Bally, Laurent; Bouchu, David; Cadix, Lionel; Farcy, Alexis; Sillon, Nicolas

Book ID: 111902605
Publisher: IEEE
Year: 2009
Weight: 753 KB
Volume: 0
Category: Article
ISBN: 1424445116
DOI: 10.1109/3dic.2009.5306602

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