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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - 3-D memory organization and performance analysis for multi-processor network-on-chip architecture

✍ Scribed by Weldezion, Awet Yemane; Lu, Zhonghai; Weerasekera, Roshan; Tenhunen, Hannu

Book ID: 115525537
Publisher: IEEE
Year: 2009
Weight: 822 KB
Volume: 0
Category: Article
ISBN: 1424445116
DOI: 10.1109/3dic.2009.5306593

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