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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - 3D integration technology for 3D stacked retinal chip

✍ Scribed by Kaiho, Y.; Ohara, Y.; Takeshita, H.; Kiyoyama, K.; Lee, K-W; Tanaka, T.; Koyanagi, M.

Book ID: 115525536
Publisher: IEEE
Year: 2009
Weight: 809 KB
Volume: 0
Category: Article
ISBN: 1424445116
DOI: 10.1109/3dic.2009.5306564

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