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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - A study on the edge traces technique for 3D stack chip

✍ Scribed by Lee, Jae Hak; Yoo, Choong D.; Song, Jun-Yeob; Lee, Seung S.; Kim, Sun-Rak

Book ID: 115525538
Publisher: IEEE
Year: 2012
Weight: 203 KB
Category: Article
ISBN: 1467321885
DOI: 10.1109/3dic.2012.6262995

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