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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Mechanical and electrical reliability of copper interconnections for 3DIC

✍ Scribed by Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo

Book ID: 115535644
Publisher: IEEE
Year: 2012
Weight: 666 KB
Category: Article
ISBN: 1467321885
DOI: 10.1109/3dic.2012.6262998

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