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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack

✍ Scribed by Matsumoto, Keiji; Ibaraki, Soichiro; Sakuma, Katsuyuki; Yamada, Fumiaki

Book ID: 115525535
Publisher: IEEE
Year: 2009
Weight: 578 KB
Volume: 0
Category: Article
ISBN: 1424445116
DOI: 10.1109/3dic.2009.5306546

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