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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - TSV reduction in homogeneous 3D FPGAs by logic resource and input pad replication

✍ Scribed by Moallempour, Seyyed Hasan; Razavi, Seyyed Ahmad; Zamani, Morteza Saheb

Book ID: 121802596
Publisher: IEEE
Year: 2012
Weight: 213 KB
Category: Article
ISBN: 1467321885
DOI: 10.1109/3DIC.2012.6263033

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