𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Monolithic 3D-ICs with single crystal silicon layers

✍ Scribed by Sekar, Deepak C.; Or-Bach, Zvi

Book ID: 121323700
Publisher: IEEE
Year: 2012
Weight: 203 KB
Category: Article
ISBN: 1467321885
DOI: 10.1109/3DIC.2012.6262978

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 IEEE International 3D Systems

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - TSV reveal etch for 3D integration

✍ Olson, Stephen; Hummler, Klaus 📂 Article 📅 2012 🏛 IEEE ⚖ 306 KB

[IEEE 2011 IEEE International 3D Systems

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Mechanical and electrical reliability of copper interconnections for 3DIC

✍ Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo 📂 Article 📅 2012 🏛 IEEE ⚖ 666 KB

[IEEE 2011 IEEE International 3D Systems

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Analysis of microbump induced stress effects in 3D stacked IC technologies

✍ Ivankovic, A.; Van der Plas, G.; Moroz, V.; Choi, M.; Cherman, V.; Mercha, A.; M 📂 Article 📅 2012 🏛 IEEE ⚖ 765 KB

[IEEE 2011 IEEE International 3D Systems

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - A study on the edge traces technique for 3D stack chip

✍ Lee, Jae Hak; Yoo, Choong D.; Song, Jun-Yeob; Lee, Seung S.; Kim, Sun-Rak 📂 Article 📅 2012 🏛 IEEE ⚖ 203 KB

[IEEE 2011 IEEE International 3D Systems

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - TSV reduction in homogeneous 3D FPGAs by logic resource and input pad replication

✍ Moallempour, Seyyed Hasan; Razavi, Seyyed Ahmad; Zamani, Morteza Saheb 📂 Article 📅 2012 🏛 IEEE ⚖ 213 KB

[IEEE 2011 IEEE International 3D Systems

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits

✍ Vollebregt, Sten; Ishihara, Ryoichi; van der Cingel, Johan; Beenakker, Kees 📂 Article 📅 2012 🏛 IEEE ⚖ 804 KB