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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Cu/Sn microbumps interconnect for 3D TSV chip stacking

✍ Scribed by Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe

Book ID: 125494933
Publisher: IEEE
Year: 2010
Weight: 897 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490698

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