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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Electrical characterization of 3D Through-Silicon-Vias

✍ Scribed by Liu, F.; Gu, X.; Jenkins, K. A.; Cartier, E. A.; Liu, Y.; Song, P.; Koester, S. J.

Book ID: 120554507
Publisher: IEEE
Year: 2010
Weight: 957 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490839

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