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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Millimeter-wave/THz passive components design using through silicon via (TSV) technology

✍ Scribed by Hu, Sanming; Wang, Lei; Xiong, Yong-Zhong; Shi, Jinglin; Zhang, Bo; Zhao, Dan; Lim, Teck Guan; Yuan, Xiaojun

Book ID: 121018667
Publisher: IEEE
Year: 2010
Weight: 675 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490919

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