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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Design and fabrication of a reliability test chip for 3D-TSV

✍ Scribed by Trigg, A D; Yu, Li Hong; Zhang, Xiaowu; Chong, Chai Tai; Kuo, Cheng Cheng; Khan, Navas; Daquan, Yu

Book ID: 120828997
Publisher: IEEE
Year: 2010
Weight: 752 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490889

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