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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics

✍ Scribed by John, Ranjith Samuel E.; Malshe, Ajay P.; Dotsenko, Vladimir; Delmas, Jean; Webber, Robert; Gupta, Deepnarayan

Book ID: 120298089
Publisher: IEEE
Year: 2010
Weight: 871 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490661

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