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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator

✍ Scribed by Yu, Aibin; Premachandran, C. S.; Nagarajan, Ranganathan; Kyoung, Choi Won; Trang, Lam Quynh; Kumar, Rakesh; Lim, Li Shiah; Han, Johnny He; Jie, Yap Guan; Damaruganath, Pinjala

Book ID: 120254616
Publisher: IEEE
Year: 2010
Weight: 991 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490754

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