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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Cost comparison for flip chip, gold wire bond, and copper wire bond packaging

✍ Scribed by Palesko, Chet A.; Vardaman, E. Jan

Book ID: 120899225
Publisher: IEEE
Year: 2010
Weight: 455 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490877

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