[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Study of a practicable wire bonding method for applying copper wire bond to large-scale integrated circuits

✍ Scribed by Jiang, Yingwei; Sun, RongLu; Wang, Sonder; Min, Ding; Chen, Weimin

• Book ID: 118146374
• Publisher: IEEE
• Year: 2010
• Weight: 930 KB
• Volume: 0
• Category: Article
• ISBN: 1424464102
• DOI: 10.1109/ectc.2010.5490848