𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Inkjet printed organic transistors for sustainable electronics

✍ Scribed by Orecchini, G.; Zhang, R.; Agar, J.; Staiculescu, D.; Tentzeris, M. M.; Roselli, L.; Wong, C. P.

Book ID: 124085928
Publisher: IEEE
Year: 2010
Weight: 974 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490659

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 Proceedings 60th Electronic C

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Inkjet-printed system-on-paper/polymer “green” RFID and wireless sensors

✍ Tentzeris, M. M.; Vyas, R.; Lakafosis, V.; Traille, A.; Rida, A.; Shaker, G. 📂 Article 📅 2010 🏛 IEEE ⚖ 419 KB

[IEEE 2010 Proceedings 60th Electronic C

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Large area embedding for heterogeneous system integration

✍ Braun, T.; Becker, K.-F.; Bottcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, 📂 Article 📅 2010 🏛 IEEE ⚖ 963 KB

[IEEE 2010 Proceedings 60th Electronic C

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - High channel-count optical interconnection for servers

✍ Taira, Yoichi; Numata, Hidetoshi; Nakagawa, Shigeru; Tokunari, Masao; Heroux, Je 📂 Article 📅 2010 🏛 IEEE ⚖ 631 KB

[IEEE 2010 Proceedings 60th Electronic C

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Electrical characterization of 3D Through-Silicon-Vias

✍ Liu, F.; Gu, X.; Jenkins, K. A.; Cartier, E. A.; Liu, Y.; Song, P.; Koester, S. 📂 Article 📅 2010 🏛 IEEE ⚖ 957 KB

[IEEE 2010 Proceedings 60th Electronic C

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Analysis of carbon nanotube based Through Silicon Vias

✍ Kannan, Sukeshwar; Gupta, Anurag; Kim, Bruce C.; Mohammed, Falah; Ahn, Byoungchu 📂 Article 📅 2010 🏛 IEEE ⚖ 1011 KB

[IEEE 2010 Proceedings 60th Electronic C

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics

✍ John, Ranjith Samuel E.; Malshe, Ajay P.; Dotsenko, Vladimir; Delmas, Jean; Webb 📂 Article 📅 2010 🏛 IEEE ⚖ 871 KB