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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Development of CMOS-process-compatible interconnect technology for 3D-stacking of NAND flash memory chips

✍ Scribed by Shi, X. Q.; Sun, P.; Tsui, Y. K.; Law, P. C.; Yau, S. K.; Leung, C. K.; Liu, Y.; Chung, C. H; Ma, S. L.; Miao, M.; Jin, Y. F.

Book ID: 121266843
Publisher: IEEE
Year: 2010
Weight: 873 KB
Category: Article
ISBN: 1424464102
DOI: 10.1109/ECTC.2010.5490884

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