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[IEEE 2009 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - San Diego, CA, USA (2009.09.9-2009.09.11)] 2009 International Conference on Simulation of Semiconductor Processes and Devices - Strain Dependence of Dielectric Properties and Reliability of High-k Thin Films

✍ Scribed by Suzuki, K.; Imasaki, K.; Ito, Y.; Miura, H.

Book ID: 126674522
Publisher: IEEE
Year: 2009
Weight: 328 KB
Category: Article
DOI: 10.1109/SISPAD.2009.5290250

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