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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Plasma altered layer model for plasma damage characterization of porous OSG films

✍ Scribed by Shi, H.; Huang, H.; Bao, J.; Im, J.; Ho, P. S.; Zhou, Y.; Pender, J. T.; Armacost, M.; Kyser, D.

No coin nor oath required. For personal study only.

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