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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - TSV-aware interconnect length and power prediction for 3D stacked ICs

✍ Scribed by Kim, Dae Hyun; Mukhopadhyay, Saibal; Lim, Sung Kyu

Book ID: 115488547
Publisher: IEEE
Year: 2009
Weight: 715 KB
Volume: 0
Category: Article
ISBN: 1424444926
DOI: 10.1109/iitc.2009.5090331

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