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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - 3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

✍ Scribed by Khan, Navas; Hong Yu, ; Pin, Tan Siow; Ho, Soon Wee; Su, Nandar; Hnin, Wai Yin; Kripesh, Vaidyanathan; Lau, John H.; Chuan, Toh Kok

No coin nor oath required. For personal study only.

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