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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Board level energy correlation and interconnect reliability modeling under drop impact

✍ Scribed by Agrawal, Akash; Levo, Tim; Pitarresi, James; Roggeman, Brian

Book ID: 115492841
Publisher: IEEE
Year: 2009
Weight: 1013 KB
Volume: 0
Category: Article
ISBN: 1424444756
DOI: 10.1109/ectc.2009.5074243

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