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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Chip On Board packaging of light emitting diodes and thermal characterizations

✍ Scribed by Labau, Sebastien; Picard, Nicolas; Gasse, Adrien; Bernabe, Stephane; Grosse, Philippe; Ribot, Herve

Book ID: 120055245
Publisher: IEEE
Year: 2009
Weight: 933 KB
Category: Article
ISBN: 1424444756
DOI: 10.1109/ECTC.2009.5074111

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