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[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Scaling in the third dimension -prospects for silicon-based interposer and 3D integration

✍ Scribed by Iyer, Subramanian S

Book ID: 115535017
Publisher: IEEE
Year: 2012
Weight: 87 KB
Category: Article
ISBN: 1467311367
DOI: 10.1109/iitc.2012.6251658

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