𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - BEOL challenges for 14nm node and beyond

✍ Scribed by Taylor, Bill; Lin, Xuan; Zhang, Xunyuan; Kim, Hoon; He, Ming; Ryan, Vivian

Book ID: 115535018
Publisher: IEEE
Year: 2012
Weight: 85 KB
Category: Article
ISBN: 1467311367
DOI: 10.1109/iitc.2012.6251662

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE International Interconne

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - 3D TSV and interposer

✍ Fraunhofer, Jurgen Wolf. 📂 Article 📅 2012 🏛 IEEE ⚖ 83 KB

[IEEE 2012 IEEE International Interconne

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - What lies ahead for interconnects and devices

✍ Mayberry, Mike 📂 Article 📅 2012 🏛 IEEE ⚖ 377 KB

[IEEE 2012 IEEE International Interconne

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - It's about the power: An architect's view of interconnect

✍ Dally, Bill 📂 Article 📅 2012 🏛 IEEE ⚖ 82 KB

[IEEE 2012 IEEE International Interconne

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - How to address metallization and reliability challenges in today and tomorrows technology nodes?

✍ Preusse, Axel; Hahn, Jens; Chowdhury, Tamjid; Hintze, Bernd; Liske, Romy; Nopper 📂 Article 📅 2012 🏛 IEEE ⚖ 86 KB

[IEEE 2012 IEEE International Interconne

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Scaling in the third dimension -prospects for silicon-based interposer and 3D integration

✍ Iyer, Subramanian S 📂 Article 📅 2012 🏛 IEEE ⚖ 87 KB

[IEEE 2012 IEEE International Interconne

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects

✍ Cao, L.; Ganesh, K. J.; Zhang, L.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ferre 📂 Article 📅 2012 🏛 IEEE ⚖ 960 KB