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[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects

✍ Scribed by Cao, L.; Ganesh, K. J.; Zhang, L.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ferreira, P. J.; Ho, P. S.

Book ID: 115535019
Publisher: IEEE
Year: 2012
Weight: 960 KB
Category: Article
ISBN: 1467311367
DOI: 10.1109/iitc.2012.6251667

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