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[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Compact modeling and performance optimization of 3D chip-to-chip interconnects with transmission lines, vias and discontinuities

✍ Scribed by Kumar, Vachan; Sharma, Rohit; Chen, Jikai; Kapoor, Abhimanyu; Bashirullah, Rizwan; Kohl, Paul; Naeemi, Azad

Book ID: 115535015
Publisher: IEEE
Year: 2012
Weight: 855 KB
Category: Article
ISBN: 1457718367
DOI: 10.1109/iitc.2012.6251646

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