✦ LIBER ✦

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Packaging characteristics of 6-layer ultra low-k/Cu dual damascene interconnect featuring advanced scalable porous silica (k=2.1)

✍ Scribed by Chikaki, S.; Soda, E.; Gawase, A.; Suzuki, T.; Kawashima, Y.; Oda, N.; Saito, S.

No coin nor oath required. For personal study only.

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