✦ LIBER ✦

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Low-k interconnect stack with a novel self-aligned via patterning process for 32nm high volume manufacturing

✍ Scribed by Brain, R.; Agrawal, S.; Becher, D.; Bigwood, R.; Buehler, M.; Chikarmane, V.; Childs, M.; Choi, J.; Daviess, S.; Ganpule, C.; He, J.; Hentges, P.; Jin, I.; Klopcic, S.; Malyavantham, G.; McFadden, B.; Neulinger, J.; Neirynck, J.; Neirynck, Y.; Pelto, C.; Plekhanov, P.; Shusterman, Y.; Van, T.; Weiss, M.; Williams, S.; Xia, F.; Yashar, P.; Yeoh, A.

Book ID: 120165372
Publisher: IEEE
Year: 2009
Weight: 283 KB
Category: Article
ISBN: 1424444926
DOI: 10.1109/IITC.2009.5090400

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2009 IEEE International Interconne

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - TSV-aware interconnect length and power prediction for 3D stacked ICs

✍ Kim, Dae Hyun; Mukhopadhyay, Saibal; Lim, Sung Kyu 📂 Article 📅 2009 🏛 IEEE ⚖ 715 KB

[IEEE 2009 IEEE International Interconne

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Conductance quantization of gold nanowires as a ballistic conductor

✍ Takayanagi, Kunio; Oshima, Yoshifumi; Kurui, Yoshihiko 📂 Article 📅 2009 🏛 IEEE ⚖ 872 KB

[IEEE 2009 IEEE International Interconne

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - A new physical model and experimental measurements of copper interconnect resistivity considering size effects and line-edge roughness (LER)

✍ Lopez, Gerald; Davis, Jeffrey; Meindl, James 📂 Article 📅 2009 🏛 IEEE ⚖ 392 KB

[IEEE 2008 International Interconnect Te

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High Volume Manufacturing

✍ Ingerly, D.; Agraharam, S.; Becher, D.; Chikarmane, V.; Fischer, K.; Grover, R.; 📂 Article 📅 2008 🏛 IEEE ⚖ 650 KB