[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High Volume Manufacturing

✍ Scribed by Ingerly, D.; Agraharam, S.; Becher, D.; Chikarmane, V.; Fischer, K.; Grover, R.; Goodner, M.; Haight, S.; He, J.; Ibrahim, T.; Joshi, S.; Kothari, H.; Lee, K.; Lin, Y.; Litteken, C.; Liu, H.; Mays, E.; Moon, P.; Mule, T.; Nolen, S.; Patel, N.; Pradhan, S.; Robinson, J.; Ramanarayanan, P.; Sattiraju, S.; Schroeder, T.; Williams, S.; Yashar, P.

• Book ID: 115532768
• Publisher: IEEE
• Year: 2008
• Weight: 650 KB
• Volume: 0
• Category: Article
• ISBN: 1424419115
• DOI: 10.1109/iitc.2008.4546971