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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - A new physical model and experimental measurements of copper interconnect resistivity considering size effects and line-edge roughness (LER)

✍ Scribed by Lopez, Gerald; Davis, Jeffrey; Meindl, James

No coin nor oath required. For personal study only.

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