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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Optimized integrated copper gap-fill approaches for 2x flash devices

✍ Scribed by Ma, Paul; Luo, Qian; Sundarrajan, Arvind; Lu, Jiang; Aubuchon, Joseph; Tseng, Jennifer; Kumar, Niranjan; Okazaki, Motoya; Wang, Yuchun; Wang, You; Chen, Yufei; Naik, Mehul; Emesh, Ismail; Narasimhan, Murali

Book ID: 126653870
Publisher: IEEE
Year: 2009
Weight: 514 KB
Category: Article
ISBN: 1424444926
DOI: 10.1109/IITC.2009.5090334

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