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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Thermal management of 3D IC integration with TSV (through silicon via)

✍ Scribed by Lau, John H.; Yue, Tang Gong

Book ID: 121289736
Publisher: IEEE
Year: 2009
Weight: 707 KB
Category: Article
ISBN: 1424444756
DOI: 10.1109/ECTC.2009.5074080

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