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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Epoxy/h-BN composites for thermally conductive underfill material

✍ Scribed by Liang, Qizhen; Xiu, Yonghao; Lin, Wei; Moon, Kyoung-Sik; Wong, C. P.

Book ID: 121265439
Publisher: IEEE
Year: 2009
Weight: 785 KB
Category: Article
ISBN: 1424444756
DOI: 10.1109/ECTC.2009.5074050

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