𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Reliability assessment of electronic components under random vibration loading

✍ Scribed by Al-Yafawi, Abdullah; Yu, Da; Park, Seungbae; Pitarresi, James; Chung, Soonwan

Book ID: 121090271
Publisher: IEEE
Year: 2009
Weight: 977 KB
Category: Article
ISBN: 1424444756
DOI: 10.1109/ECTC.2009.5074049

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2009 IEEE 59th Electronic Componen

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Antenna miniaturization using magneto-dielectric substrates

✍ Altunyurt, Nevin; Swaminathan, Madhavan; Raj, P. Markondeya; Nair, Vijay 📂 Article 📅 2009 🏛 IEEE ⚖ 653 KB

[IEEE 2009 IEEE 59th Electronic Componen

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Board level energy correlation and interconnect reliability modeling under drop impact

✍ Agrawal, Akash; Levo, Tim; Pitarresi, James; Roggeman, Brian 📂 Article 📅 2009 🏛 IEEE ⚖ 1013 KB

[IEEE 2009 IEEE 59th Electronic Componen

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Epoxy/h-BN composites for thermally conductive underfill material

✍ Liang, Qizhen; Xiu, Yonghao; Lin, Wei; Moon, Kyoung-Sik; Wong, C. P. 📂 Article 📅 2009 🏛 IEEE ⚖ 785 KB

[IEEE 2009 IEEE 59th Electronic Componen

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Chip On Board packaging of light emitting diodes and thermal characterizations

✍ Labau, Sebastien; Picard, Nicolas; Gasse, Adrien; Bernabe, Stephane; Grosse, Phi 📂 Article 📅 2009 🏛 IEEE ⚖ 933 KB

[IEEE 2009 IEEE 59th Electronic Componen

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Novel on-chip variable delay transmission line with fixed characteristic impedance

✍ Woods, Wayne; Hanyi Ding, ; Guoan Wang, 📂 Article 📅 2009 🏛 IEEE ⚖ 704 KB

[IEEE 2009 IEEE 59th Electronic Componen

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - 3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

✍ Khan, Navas; Hong Yu, ; Pin, Tan Siow; Ho, Soon Wee; Su, Nandar; Hnin, Wai Yin; 📂 Article 📅 2009 🏛 IEEE ⚖ 960 KB