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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Study of 15µm pitch solder microbumps for 3D IC integration

✍ Scribed by Yu, Aibin; Lau, John H.; Ho, Soon Wee; Kumar, Aditya; Hnin, Wai Yin; Yu, Da-Quan; Jong, Ming Ching; Kripesh, Vaidyanathan; Pinjala, Damaruganath; Dim-Lee Kwong,

Book ID: 120826167
Publisher: IEEE
Year: 2009
Weight: 745 KB
Category: Article
ISBN: 1424444756
DOI: 10.1109/ECTC.2009.5073988

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