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[IEEE 2006 IEEE International Conference on Microelectronic Test Structures - Austin, TX, USA (2006.03.6-2006.03.9)] 2006 IEEE International Conference on Microelectronic Test Structures - Impact of pad de-embedding on the extraction of interconnect parameters

✍ Scribed by Sangwook Han, ; Jooyong Kim, ; Neikirk, D.P.

Book ID: 121202768
Publisher: IEEE
Year: 2006
Weight: 446 KB
Category: Article
ISBN-13: 9781424401673
DOI: 10.1109/ICMTS.2006.1614279

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