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[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - The properties of reactive sputtered TiN films for VLSI metallization

✍ Scribed by Inoue, M.; Hashizume, K.; Watanabe, K.; Tsuchikawa, H.

Book ID: 126652123
Publisher: IEEE
Year: 1988
Weight: 221 KB
Category: Article
DOI: 10.1109/VMIC.1988.14195

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