✦ LIBER ✦

Fabrication of 0.95Sn−0.05Au solder micro-bumps for flip-chip bonding

✍ Scribed by Takao Ishii; Shinji Aoyama; Masami Tokumitsu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Novel micro-bump fabrication for flip-ch

✍ Takao Ishii; Shinji Aoyama 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 577 KB

Influence of Cu content on compound form

✍ Guh-Yaw Jang; Jeng-Gong Duh; Hideyuki Takahashi; Szu-Wei Lu; Jen-Chuan Chen 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 492 KB

A novel flip-chip interconnection techni

✍ Katsura, K.; Hayashi, T.; Ohira, F.; Hata, S.; Iwashita, K. 📂 Article 📅 1990 🏛 Optical Society of America 🌐 English ⚖ 589 KB

Study of Intermetallic Growth and Kineti

✍ Ye Tian, Justin Chow, Xi Liu, Yi Ping Wu, Suresh K. Sitaraman 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 839 KB

Development of new assembly techniques f

✍ Y. Saitoh; H. Takeuchi; M. Mandai; H. Kanazawa; J. Yamanaka; S. Miyahara; M. Kam 📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 377 KB