Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method

✍ Scribed by Y. Saitoh; H. Takeuchi; M. Mandai; H. Kanazawa; J. Yamanaka; S. Miyahara; M. Kamiya; Y. Fujita; Y. Higashi; H. Ikeda; M. Ikeda; S. Koike; T. Matsuda; H. Ozaki; M. Tanaka; T. Tsuboyama; S. Avrillon; S. Okuno; J. Haba; H. Hanai; S. Mori; K. Yusa; C. Fukunaga

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 377 KB
• Volume: 342
• Category: Article
• ISSN: 0168-9002
• DOI: 10.1016/0168-9002(94)91443-5