๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers

โœ Scribed by Katsura, K.; Hayashi, T.; Ohira, F.; Hata, S.; Iwashita, K.

Book ID
118028248
Publisher
Optical Society of America
Year
1990
Tongue
English
Weight
589 KB
Volume
8
Category
Article
ISSN
0733-8724

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

[IEEE IEEE International Conference on S
[IEEE IEEE International Conference on Simulation of Semiconductor Processes and Devices - Boston, MA, USA (2003.09.3-2003.09.5)] International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. - A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures
โœ Jiao, D.; Mazumder, M.; Chakravarty, S.; Dai, C.; Kobrinsky, M.J.; Harmes, M.C.; ๐Ÿ“‚ Article ๐Ÿ“… 2003 ๐Ÿ› IEEE ๐ŸŒ English โš– 424 KB