A new packaging technology using micro-solder bumps for high-speed photoreceivers

✍ Scribed by Tsunetsugu, H.; Katsura, K.; Hayashi, T.; Ishitsuka, F.; Hata, S.

• Book ID: 114560353
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 621 KB
• Volume: 15
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.159888