A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps

✍ Scribed by Jung-Tang Huang; Pen-Shan Chao; Hou-Jun Hsu; Sheng-Hsiung Shih

• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 951 KB
• Volume: 10
• Category: Article
• ISSN: 1369-8001
• DOI: 10.1016/j.mssp.2007.07.001