✦ LIBER ✦

Novel micro-bump fabrication for flip-chip bonding

✍ Scribed by Takao Ishii; Shinji Aoyama

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Fabrication of 0.95Sn−0.05Au solder micr

✍ Takao Ishii; Shinji Aoyama; Masami Tokumitsu 📂 Article 📅 2001 🏛 Springer US 🌐 English ⚖ 245 KB

Flip-chip bump-lead fabrication: A revie

✍ V. V. Zenin; E. P. Novokreshchenova; O. V. Khishko 📂 Article 📅 2008 🏛 Springer 🌐 English ⚖ 263 KB

Flip chip bonding technique using transf

✍ Tsunetsugu, H.; Hayashi, T.; Hosoya, M.; Katsura, K.; Hirano, M.; Imai, Y. 📂 Article 📅 1997 🏛 IEEE ⚖ 1013 KB

Development of under bump metallizations

✍ T. M. Korhonen; P. Su; S. J. Hong; M. A. Korhonen; C. -Y. Li 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 203 KB

Solder-jetted eutectic PbSn bumps for fl

✍ Baggerman, A.F.J.; Schwarzbach, D. 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 942 KB

Precision flip-chip solder bump intercon

✍ Imler, W.R.; Scholz, K.D.; Cobarruviaz, M.; Nagesh, V.K.; Chao, C.C.; Haitz, R. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 657 KB