✦ LIBER ✦
Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies
✍ Scribed by Ye Tian, Justin Chow, Xi Liu, Yi Ping Wu, Suresh K. Sitaraman
- Book ID
- 118816475
- Publisher
- Springer US
- Year
- 2012
- Tongue
- English
- Weight
- 839 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0361-5235
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