Evaluation of solder joint reliability in flip-chip packages during accelerated testing

✍ Scribed by Jong-Woong Kim; Dae-Gon Kim; Won Sik Hong; Seung-Boo Jung

• Book ID: 107453431
• Publisher: Springer US
• Year: 2005
• Tongue: English
• Weight: 901 KB
• Volume: 34
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-005-0164-8