✦ LIBER ✦
Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing
✍ Scribed by S.W. Liang; Y.W. Chang; Chih Chen
- Book ID
- 107453575
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 377 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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