Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)

✍ Scribed by Seung Wook Yoon; Chang Jun Park; Sung Hak Hong; Jong Tae Moon; Ik Seong Park; Heung Sup Chun

• Publisher: Springer US
• Year: 2000
• Tongue: English
• Weight: 508 KB
• Volume: 29
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-000-0018-3