✦ LIBER ✦
Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)
✍ Scribed by Cho-Liang Chung; Liang-Tien Lu; Yao-Jung Lee
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 598 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0026-2714
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